Semiconductor manufacturing equipment pick and taping device "HPT-05FH"
Supports chips smaller than 0.3mm! Next-generation manufacturing equipment designed for the miniaturization of electronic components!
This is a device that picks up diced devices attached to a wafer one by one, undergoes visual inspection (image processing), and tapes the good products onto an embossed tape.
- Company：ハイメカ
- Price：10 million yen-50 million yen
